In the realm of traditional LED lighting, heat dissipation has consistently been a pivotal factor constraining performance enhancement. As LED technology advances rapidly toward higher luminous efficiency and power, the complexity of high-power LED packaging has become a direct determinant of LED performance and longevity. In intricate application contexts, high-power LEDs are confronted with accelerated light decay and diminished stability due to inadequate heat dissipation, posing urgent challenges for the industry.

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To tackle the limitations of conventional high-power packaging solutions, HF has introduced an innovative diamond-based substrate technology, launching the pioneering Diamond-based Ultra-high Power Density Packaging. This product caters to the high-power LED demands in applications such as automotive headlights, outdoor high-intensity lighting, and stage illumination, unlocking new possibilities for the development and application of high-power LEDs.

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01 High Thermal Conductivity and Superior Heat Dissipation PerformanceIn high-power applications like automotive headlights, traditional ceramic materials often experience severe light decay, reduced lifespan, or even burnout due to insufficient heat dissipation. Refond's diamond-based substrate, with a thermal conductivity of up to 1800 W/(m·K)—tenfold that of ceramic materials—enables continuous brightness enhancement while ensuring stable operation of the LED chip at higher power levels.

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02 Compact Single-Lamp Size and High Luminous EfficiencyThe new product is available in a range of specifications, with the smallest single-lamp size measuring just 5 mm × 5 mm. Fully compatible with mainstream market standards, it allows for direct replacement of existing solutions, thereby significantly reducing maintenance costs. It meets the requirements of various high-efficiency application scenarios, making it particularly suitable for situations demanding.

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03 High Single-Lamp Power, Excellent Optical Performance

In terms of optical performance, We have significantly reduced light propagation losses through the innovative design of the diamond-based substrate packaging structure. The single-lamp power can reach 60W, with a luminous flux exceeding 6500lm. The light distribution is brighter and more uniform, delivering outstanding optical performance in scenarios requiring high brightness and uniformity, such as projectors.

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04 Advanced Packaging Technology, Higher Reliability

Diamond material has a low thermal expansion coefficient, which reduces thermal stress caused by temperature changes and prevents issues such as cracking or delamination. Our diamond-based ultra-high power density packaging utilizes proprietary advanced packaging technology, effectively enhancing the reliability, stability, and lifespan of the device. This characteristic is particularly important in professional lighting scenarios such as stage lighting, ensuring excellent performance even under high-intensity operation.

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Innovation Drives the Future

Explore & Infinite

The launch of the new diamond-based ultra-high power density packaging product is undoubtedly a significant breakthrough in the lighting field. It brings a qualitative improvement to current lighting applications and injects new vitality into the development of high-end lighting. It is gradually demonstrating immense potential in applications such as outdoor lighting, automotive lighting, drone lighting, projectors, and stage lighting.

Relying on its innovative breakthroughs in ultra-high power density packaging technology, We will continue to drive product upgrades and iterations, further enhancing the competitiveness of its products to meet the market's diverse application demands for high-efficiency, high-performance LED light sources.